PART I: DESIGN\n3D Design Styles\nDesign Enablement and Advantages of Ultra-Fine Pitched 3D-Stacked Integrated Circuits\nWyoming Case Study\nIBM Interposers\nInterposer Interconnect Circuits\nSignal Integrity for 3D\nPower Integrity for 3D\n2.5D/3D Design Flow\nMonolithic 3D\nEDA for 3D\n3D Memories\n3D Clock Distribution\nPART II: TEST\nCost Modelling for 2.5D and 3D Stacked ICs\nInterconnect Testing for 2.5D and 3D Stacked ICs\nPre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps\n3D Design-for-Test Architecture\nOptimization of Test-Access Architectures and Test Scheduling for 3D ICs\nIEEE P1838 3D Test Access Standard-in-Development\nTest and Debug Strategy for TSMC CoWoS Stacking Process Based Heterogeneous 3D IC: A Silicon Case Study\nPART III: THERMAL MANAGEMENT\nThermal Challenges and Emerging Solutions for 3D and 2.5D IC\nThermal Modeling and Experimental Model Validation for 3D Stacked ICs\nThermal Design for 3D ICs with Micro-Fluidics