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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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- Wydawnictwo: Springer-Verlag New York Inc.
- Kod:
- Rok wydania: 2009
- Język: Angielski
- Oprawa: Twarda
- Liczba stron: 285
- Szerokość opakowania: 16.5 cm
- Wysokość opakowania: 24.2 cm
- Głębokość opakowania: 2.3 cm
- Waga: 594 g
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