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This book presents an overview of the field of 3D IC design. There is emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design.
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This book presents an overview of the field of 3D IC design. There is emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design.
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- Wydawnictwo: Springer-Verlag New York Inc.
- Kod:
- Rok wydania: 2009
- Język: Angielski
- Oprawa: Twarda
- Liczba stron: 284
- Szerokość opakowania: 16.2 cm
- Wysokość opakowania: 24.2 cm
- Głębokość opakowania: 2.4 cm
- Waga: 592 g
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